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YearMilestoneRelease DateNotesHighlights
20262026-Q1 (M3)

 

  • This is the RDK8 RC1 Candidate
  • Uses OSS Consumption Model so OSS is no longer built as a standalone layer
  • First release to use appmanager and signed BOLT packages
  • Applications are now DAC applications and are integrated as part of Image Assembler so Application Layer no longer exists
2026M2

 

  • This release uses the OSS Consumption Model (OSS is now part of Vendor Layer)
  • This will be the last RDK release using RDKShell for Application management functionalities. After this release, RDK AppManagers framework will be used.
  • This will be the last Application Layer release. All applications will be DAC‑based starting from the next RDKE releases. Therefore, the Application Layer will be removed from the RDKE stack.
  • BRCM 974116 only B0 is now supported.
2026M1

 

Release Tags and Layer Release Notes 

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titleM2

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Platform Release Details


Platform

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Type

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SOC

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OEM

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4.10.0

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8.5.2.1

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M2 Layer Release Notes 

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4.10.0

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M2 TAG Information

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Access

Raspberry Pi 4

Generic Reference deviceBroadcomRaspberry Pi FoundationNo Restrictions

IP STB BCM 74116

SOC Reference deviceBroadcomNARestricted to those LDAP groups who have access to the Broadcom SoC Collaboration Repositories

IP STB RTK 1325

SOC Reference deviceRealtekNARestricted to those LDAP groups who have access to the Realtek SoC Collaboration Repositories


If you require access to a release note please raise a request by emailing support@rdkcentral.com 

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Image Assembler Manifests

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titleM1

M1 Release Tags 

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Vendor TAG

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MW TAG

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4.9.0

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8.5.1.0

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M1 Layer Release Notes 

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4.9.0

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