Year	Milestone	Release Date	Highlights
2026	2026-Q1 (M3)	08 Apr 2026	This is the RDK8 RC1 Candidate Uses OSS Consumption Model so OSS is no longer built as a standalone layer First release to use appmanager and signed BOLT packages Applications must now be pre-built and signed separately to yocto build Refer to Tooling Requirements for Factory App Integration in RDK8 for more info Applications are now DAC applications and are integrated as part of Image Assembler so Application Layer no longer exists
2026	M2	05 Mar 2026	This release uses the OSS Consumption Model (OSS is now part of Vendor Layer) This will be the last RDK release using RDKShell for Application management functionalities. After this release, RDK AppManagers framework will be used. This will be the last Application Layer release. All applications will be DAC‑based starting from the next RDKE releases. Therefore, the Application Layer will be removed from the RDKE stack. BRCM 974116 only B0 is now supported.
2026	M1	05 Feb 2026

Platform Release Details

Platform	Type	SOC	OEM	Access
Raspberry Pi 4	Generic Reference device	Broadcom	Raspberry Pi Foundation	No Restrictions
IP STB BCM 74116	SOC Reference device	Broadcom	NA	Restricted to those LDAP groups who have access to the Broadcom SoC Collaboration Repositories
IP STB RTK 1325	SOC Reference device	Realtek	NA	Restricted to those LDAP groups who have access to the Realtek SoC Collaboration Repositories

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