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CCSP High Level Architecture

Introduction

This document provides a high level view of how CCSP components communicate with each other and fit together to form larger device profiles. It provides overview information on the CCSP Message Bus and CCSP Component Registry and other core infrastructural framework components.

CCSP High Level Architecture Overview

CCSP High Level Architecture

Above figure illustrates the core building blocks of the CCSP Platform at a high level along with the IPC mechanism used to communicate with each other. These core components are explained in later sections.

The architecture is structured into two layers:

1. CCSP Services Layer
2. Core Device Platform

The CCSP components in the CCSP Services Layer communicate among each other via the CCSP internal message bus. The CCSP message bus is based on D-Bus.

The Core Device Platform includes the Linux OS libraries, Free and Open Source Software (FOSS) and drivers accessible via Hardware Abstraction Layers (HAL).

CCSP components in the CCSP Services Layer call into OS primitives via POSIX interfaces. Since the CCSP platform is implemented and optimized for Linux OS, there is no need for an additional RTOS abstraction Layer. The necessary abstraction is provided by POSIX.

Below illustrates various components of the RDKB stack.

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