RDK-B is developed as a modular software stack built from a collection of individually reusable software components and is based on the following design considerations:

• Software modularity
• Abstraction of external management protocols
• Independence from wide area network type
• Silicon independence
• Linux kernel independence
• Software structure that allows multiple organizations and teams to work in parallel

The architecture supports pluggable component modules which communicate over the CCSP message bus. RDK-B uses a collection of protocol agent components and supports multiple device management protocols(TR-069, SNMP etc). Protocol agents process the protocol specific details and provide abstraction to the common internal data model.

TR-181 data model is the common internal data model used by all RDK-B components to communicate over the message bus. RDK-B also supports multiple SoC vendors through component level hardware abstraction layers.

• RDKB is architected with “Software Components” . A software component is a software package that delivers a set of features or services. 

          Examples: Cable Modem (CM) Agent, EPON Agent, DSL Agent, WiFi AP Manager, TR-069 Protocol Adapter, WebPA, DMCLI.

• RDK-B is Yocto based and it can run on any modern Linux kernel and can easily be ported/customised by developers.
• Also, RDK-B is not dependent on WAN type and supports DOCSIS and EPON.

CCSP High Level Architecture

Introduction

This document provides a high level view of how CCSP components communicate with each other and fit together to form larger device profiles. It provides overview information on the CCSP Message Bus and CCSP Component Registry and other core infrastructural framework components.

CCSP High Level Architecture Overview

CCSP High Level Architecture

Above figure illustrates the core building blocks of the CCSP Platform at a high level along with the IPC mechanism used to communicate with each other. These core components are explained in later sections.

The architecture is structured into two layers:

1. CCSP Services Layer
2. Core Device Platform

The CCSP components in the CCSP Services Layer communicate among each other via the CCSP internal message bus. The CCSP message bus is based on D-Bus.

The Core Device Platform includes the Linux OS libraries, Free and Open Source Software (FOSS) and drivers accessible via Hardware Abstraction Layers (HAL).

CCSP components in the CCSP Services Layer call into OS primitives via POSIX interfaces. Since the CCSP platform is implemented and optimized for Linux OS, there is no need for an additional RTOS abstraction Layer. The necessary abstraction is provided by POSIX.

Below illustrates various components of the RDKB stack.